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| CYStech Electronics Corp. 80V/100mA SURFACE MOUNT SWITCHING DIODE Spec. No. : C332SY Issued Date : 2004.04.16 Revised Date : Page No. : 1/1 CASD355SY Features: Designed for mounting on small surface Extremely thin / leadless package Low leakage current High mounting capability, strong surge withstand, high reliability Mechanical data: Case: 1005(2512) standard package, molded plastic, JEDEC SOD-323 Terminals : Gold plated, solderable per MIL-STD-750, method 2026. Polarity: Indicated by cathode band Mounting position: Any Weight: 0.006 gram (approximately) Absolute Maximum Ratings(At Ta=25, unless otherwise noted) Characteristics Repetitive Peak Reverse Voltage Reverse Voltage Average Forward Current Peak Forward Surge Current @8.3ms, single half sine-wave superimposed on rated load(JEDEC method) Repetitive Peak Forward Current Power Dissipation Junction Temperature Storage Temperature Range Symbol VRRM VR IO IFSM IFRM PD Tj Tstg Min -55 -55 Typ 1000 Max 90 80 100 225 300 +125 +125 Unit V V mA mA mA mW C C Electrical Characteristics ( At Ta=25C, unless otherwise noted) Parameter Forward Voltage Reverse Current Diode Capacitance Reverse Recovery Time Conditions IF=100mA VR=80V VR=0.5V, f=1MHz IF=10mA,VR=6V,IRR=0.1xIR, RL=50 Symbol VF IR CD trr Min Typ Max 1 100 3 4 Unit V nA pF ns CASD355SY CYStek Product Specification CYStech Electronics Corp. Characteristic Curves Spec. No. : C332SY Issued Date : 2004.04.16 Revised Date : Page No. : 2/2 Reverse Leakage Current vs Temperature Forward Current vs Forward Voltage 1000 Reverse Leakage Current---IR(nA) 10000 125 1000 75 100 25 10 Forward Current---IF(mA) 100 125 75 25 -25 10 1 0 0.2 0.4 0.6 0.8 1 1.2 Forward Voltage---VF(V) Diode Capacitance vs Reverse Voltage 5 1 0 10 20 30 40 50 60 70 80 Ambient Temperature---TA() Forward Current vs Ambient Temperature 125 Percentage of Peak Average Forward Current(%) Diode Capacitance---CD(pF) 4 3 2 1 0 0 2 4 6 8 f=1MHz Ta=25 Mounting on glass epoxy PCBs 100 75 50 25 0 10 12 14 0 25 50 75 100 125 150 Reverse Voltage---VR(V) Ambient Temperature---Ta() CASD355SY CYStek Product Specification CYStech Electronics Corp. SOD-323(1005) Dimension Spec. No. : C332SY Issued Date : 2004.04.16 Revised Date : Page No. : 3/3 SOD-323(1005) Plastic Surface Mounted Package CYStek Package Code : SY *:Typical DIM A B C Inches Min. Max. 0.095 0.102 0.043 0.051 0.014(typ) Millimeters Min. Max. 2.4 2.6 1.1 1.3 0.35(typ) DIM D E F Inches Min. Max. 0.027 0.035 0.012(typ) 0.014(typ) Millimeters Min. Max. 0.7 0.9 0.30(typ) 0.35(typ) Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material : * Lead : 42 Alloy ; solder plating * Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. * CYStek reserves the right to make changes to its products without notice. * CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. CASD355SY CYStek Product Specification |
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